Sol-gel bonding
US5516388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1994 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Sep 11, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/565
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Preexisting elements are bonded by placing a sol-gel solution between juxtapositioned surfaces of the elements and sintering a gel formed from the solution at a temperature, which does not damage the elements, to form a sol-gel derived bonding material. The elements may be constructed of glasses, metals, infrared transmissive materials, or diamond, and bonded by sintering at about 300.degree. C. The bonding material may be resistant to high temperature and may have properties, such as refractive index, selected by varying the composition of the sol-gel solution. Optical and electronic articles are constructed by preparing a mandrel conforming to a substrate, which may be of arbitrary shape; depositing a coating on the mandrel; bonding the coating to the substrate with a sintered sol-gel; and removing the mandrel, as by etching. Diamond films formed by chemical vapor deposition at temperatures destructive to optical and microelectronic materials are thus mounted on variously shaped elements of these materials for protection against erosion and high temperatures and to provide low friction and high thermal conduction. Tetraethyl orthosilicate used as a sol-gel precursor gives a silic…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.