Method and apparatus for electrolytically plating copper
US5516414A · kind A · utility
17Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1994 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Oct 11, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution (14); and passing an electric current through the plating solution between the insoluble anode (16) and the base metal (18) to be plated. The apparatus (10) includes a plating tray (12), a pyrophosphate plating solution (14) including a soluble source of copper, an insoluble anode (16) and a power source (20). A copper plated product (P) is also disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.