Epoxy group-containing silicone resin and compositions based thereon
US5516858A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1995 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Apr 10, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising PA1 (A) 100 weight parts of a curable resin; and PA1 (B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula EQU (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.c wherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90.degree. C. to 150.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.