Structure of the flexing section of a multilayer flexible circuit board
US5516989A · kind A · utility
38Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1995 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Feb 10, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09109
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure of the flexing section of a multilayer flexible circuit board wherein at least one layer of a flexible insulation base material is bonded, via an adhesive agent layer, between a plurality of wiring conductors on which required wiring patterns are formed with conductive foil, the flexible insulation base material of the flexing section of the multilayer flexible circuit board being provided with a non-bonded portion so that it is not bonded with the wiring conductors or another flexible insulation base material at least on one surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.