High-voltage electronic component
US5517171A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1994 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Mar 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-voltage electronic component including a terminal connection structure capable of connecting a lead wire to a terminal fitment without soldering. An insulating substrate having a resistance element for a variable resistor formed on a front surface thereof and a high-voltage resistor are received in a hollow insulating casing. The insulating substrate is mounted on a rear surface thereof with a terminal fitment. The terminal fitment is formed with a press-fit channel in which a lead wire is press-fitted. Upon press fitting of the lead wire, the insulating casing is formed with an opening, through which insulating resin is charged in the insulating casing to form an insulating resin layer in which the terminal fitment and lead wire are embedded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.