Arrangement for the conduction away of heat and a process for the production thereof

US5518758A · kind A · utility

Assignee

• EMI—TEC Elektronische Materialien GmbH · DE

Inventors

• Bernd Tiburtius · Kleinmachnow, DE
• Helmut Kahl · Berlin, DE

Key dates

• Filing date: Nov 18, 1994
• Grant date: May 21, 1996
• Expiry date: Nov 18, 2014

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A heat diffuser for conducting heat away from a heat generating assembly. The heat diffuser is composed of a heat-conducting polymeric material. The heat diffuser is formed by dispensing strips of the polymeric material directly onto a surface area of the assembly. A computer-controlled nozzle assembly is utilized to disperse the polymeric material. The heat diffuser may be composed of multiple layers wherein the polymeric material for different layers has different mechanical and/or heat conducting properties.