Polymerisable compositions
US5519083A · kind A · utility
7Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1994 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | Jun 15, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Highly filled, curable compositions containing a curable liquid, e.g. methyl methacrylate; 20 to 80% by weight of a finely divided inorganic filler of defined particle size, e.g. silica; a non-functionalized polymer containing a low Tg component which is soluble in the curable liquid, e.g. a non-functionalized vinyl aromatic/conjugated diene block copolymer; and other components which diperse the filler in the curable liquid and couple the filler to the matrix can be used to produce cured composites which show improved resistance to stress induced by thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.