EMI grounding cap structure for use in mounting a printed circuit board on a plated housing boss
US5519169A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1994 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | Mar 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A specially designed metal grounding cap is placed over a metal-plated housing boss upon which a printed circuit board is to be mounted by extending a screw through a hole in the circuit board and tightening the screw into a metal insert previously forced into the free end of the mounting boss. As the screw is tightened into the boss insert, an EMI grounding pad on the underside of the circuit board engages an end wall of the grounding cap and pushes it into forcible engagement with the inner end of the boss. The forcible engagement of the grounding cap end wall causes leg portions of the cap to pivot inwardly and engage portions of the plated boss side wall between the boss insert and the metal plated housing wall from which the boss inwardly projects. The installed grounding cap thus serves as a conductive bridge around plating disturbances on the boss, in the region of the forcibly installed insert therein, to maintain an EMI grounding path from the installed circuit board to the metal plating on the housing wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.