Adhesives, adhesive layers for electroless plating and printed circuit boards
US5519177A · kind A · utility
39Cited by
18References
68Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1994 |
| Grant date | May 21, 1996 |
| Priority date | — |
| Expiry date | May 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.