Process for producing a heat sink fin
US5519938A · kind A · utility
13Cited by
19References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Nov 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53122
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fin assembly for use as a heat sink and production thereof are disclosed. The fin assembly comprises a plurality of heat dissipating plates formed by means of a multi-wire saw, and the heat dissipating plates each has a thickness of no more than 1 mm and being spaced apart by a gap of no more than 1.5 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.