Exothermic resistor element and thermal process air flow meter using the same
US5520047A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Mar 4, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/698
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In the thermal process air flow meter according to the invention first, second and third electrode terminals are arranged on the same surface at one end of a substrate. A first exothermic resistor is connected between the first and second terminals, and a second exothermic resistor is connected between the second and third terminals, with the first exothermic resistor on a front surface of a substrate and the second exothermic resistor on the opposite (back) surface. The substrate may also carry the semiconductor elements of an electronic circuit used to analyze electric signals from the terminals. In a preferred embodiment of the invention, the substrate is mounted at an incline relative to the direction of unobstructed air flow in the air passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.