Increased wall thickness for robust bond for micromachined sensor
US5520054A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Mar 29, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0042
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromachined device is described receiving a pressurizable fluid has a plurality of layers bonded together along at least one bond interface, the bond interface having a terminus bordering the pressurizable fluid. In a vicinity of at least one bond interface at least one layer has a shape that reduces a stress magnitude near the bond terminus. In a preferred embodiment a width of at least one layer increases toward the bond interface, to increase the pressure at which the device can operate without fracturing. In another embodiment, both layers bordering the bond interface have widths in the vicinity of the bond interface that increase toward the bond interface. Alternately, the layers have walls shaped such that, for a reference line perpendicular to the bond interface and passing through an end of the bond interface bordering the cavity, the cavity protrudes between the reference line and at least one of the walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.