Method of surface preparation of aluminum substrates
US5520768A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Oct 21, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C2222/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A surface preparation process has been developed for aluminum and aluminum alloy substrates that greatly improves the resulting bond. The process improves bond strength, fracture toughness, durability and failure mode of adhesive bonds. The process also decreases the sensitivity of aluminum substrates to processing variables such as humidity, temperature and hence the processing timelines. The process involves treating an aluminum surface with a solution of an alkali metal metasilicate, and subsequently treating the surface with a solution of an organofunctional silane. Employing this two step process, bonding to the aluminum substrate is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.