Composite enclosure for electronic hardware
US5520976A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention contemplates a significant departure from known shielded enclosure designs by providing an enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material. The present invention further contemplates methods for making shielded enclosures and card guides for such enclosures that represent a significant improvement over known enclosure designs. This invention contemplates composite cold walls and composite fins. These composite fins and cold walls may be used alone or together in structures and enclosures which are useful in conducting heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.