Laser cutting apparatus
US5521352A · kind A · utility
31Cited by
12References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1993 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Sep 23, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/364
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting a material having a thickness, T, defined by the distance between a first surface and a second surface of the material. The apparatus comprises an energy source for providing a beam of energy, and directing mirrors for directing the beam of energy from the energy source to a first focal point between the first and second surfaces of the material, and to a second focal point between the first and second surfaces of the material. The first and second focal points are spaced apart from each other by a distance sufficient to cut through the entire thickness of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.