Ceramic base and metallic member assembly
US5521438A · kind A · utility
10Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Sep 23, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a ceramic base and metallic member assembly, a metallic member such as an input/output terminal is joined by solder to a ceramic base substrate by way of a stress relief layer. The ceramic base substrate has a metallized layer on which the stress relief layer is formed by plating. The stress relief layer is made of soft metal such as copper and has the thickness equal to or larger than 25 .mu.m. In one embodiment, a barrier made of glass or an organic insulating material for preventing outflow of solder is formed on a peripheral portion of a joining surface of the stress relief layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.