Combination and method for coupling a heat sink to a semiconductor device
US5521439A · kind A · utility
30Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1994 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Apr 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.