Microwave hybrid coupler
US5521563A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | May 28, 1996 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/187
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A hybrid coupler which includes a substrate of an insulating material having a pair of opposed surfaces. A conductive ground plane is on one of the substrate surfaces. A pair of conductive transmission lines are over the other substrate surface and a layer of a dielectric material is over the other substrate surface. Each of the transmission lines has one portion which is on the substrate surface and under the dielectric layer, another portion which is over the dielectric layer and a connecting portion which electrically connects the two portions of the transmission line. Each of the connecting portion extends through an opening in the dielectric layer and one of the connecting portions crosses over the other connecting portion. The portions of the transmission lines may extend in straight lines, in a serpentine path or in a rectangular path. The portions of the transmission lines have ports at one end with the ports of the one portions of the lines being adjacent the same edge of the substrate, and the ports of the other portions of the lines being adjacent the same edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.