Conductive materials based on encapsulated conductive polymers
US5523021A · kind A · utility
7Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Dec 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention concerns conductive materials based on an encapsulated conductive polymer. Encapsulation in a shell of polymer stabilizes the conductivity of these materials, which can be encapsulated in a shell of film-generating polymer, to give the material formed very good mechanical properties, unlike conductive polymers which existed in the prior art, which, if not encapsulated, form brittle materials that are less stable in time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.