Process for molding epoxy resins with coarse decorative particles
US5523044A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Jun 14, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2714
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width which is at least twice the maximum size of the decorative particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.