Heat sink and method of fabricating
US5523049A · kind A · utility
25Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Nov 1, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A heat sink composed of thermally conductive particles dispersed in a monolithic structure having a continuous microstructure; and the method of forming a heat sink by molding the heat sink from a thermoplastic or epoxy material which has been filled with thermally conductive particles, debinding the molded heat sink and densifying the debound heat sink into a monolithic structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.