Patent · US Expired

Method and apparatus for forming splices in flexible, fusible material and material spliced accordingly

US5523139A · kind A · utility

1Cited by
3References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 21, 1993
Grant dateJun 4, 1996
Priority date
Expiry dateSep 21, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/197
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Disclosed is a method and apparatus for forming diagonal splices in flexible, fusible material and the material spliced accordingly. The splice is formed by overlapping the material, tensioning the material at the area to be spliced, and heating a strip of the material under tension to its fusion temperature, thereby fusing and separating the material at the strip. The splice is nearly undetectable to the untrained eye.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.