Coplanar linear dual switch module
US5523620A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Feb 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A readily manufacturable low inductance linear semiconductor switching module having coplanar contacts. Also disclosed is a pretestable terminal subassembly for such a module, and a method of making such a terminal subassembly. The module can contain high power, high frequency semiconductor switching devices, operating at high power but low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The terminal subassembly is readily fabricated and assembled into the module. In addition, it permits use of short internal leads that are readily connected to the terminal subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.