Microstrip DC-to-GHZ field stacking balun
US5523728A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1994 |
| Grant date | Jun 4, 1996 |
| Priority date | — |
| Expiry date | Aug 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wideband (DC to GHz) PC-board Balun that is disclosed. The balun mainta low insertion loss and good balance for ultra wide band (UWB) applications such as impulse radar. The balun structure is formed by microstrip transmission lines on a dielectric substrate, having at least one inverting and one non-inverting transmission lines. The transmission lines are connected to form balanced transmission lines stacked about a ground plane. N transmission lines can be connected to form a N.sup.2 :1 impedance ratio balun. Ferrite cores placed about the transmission lines and resistor-capacitor circuits improve the low frequency operation of the balun.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.