Multi-layer EMI/RFI gasket shield
US5524908A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1994 |
| Grant date | Jun 11, 1996 |
| Priority date | — |
| Expiry date | Sep 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/92
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An multi-layered EMI gasket has a first layer constructed of an electrically conductive resilient material and a second, support layer of an electrically conductive material secured in facing engagement with the first layer. The material of the second layer is more rigid than the material of the first layer, so that the second layer imparts rigidity to the gasket. Preferably, the resilient material is carbon particle filled EPTFE and the support layer is a metal foil. The combination of these elements is very effective at conducting electrical signals, thereby providing exceptional EMI/RFI shielding of electronic components, while being far easier to handle and install than prior art gaskets. Further, the resilient material of the first layer permits the gasket to conform to irregular surfaces, thus providing an excellent environmental seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.