Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board
US5525181A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1994 |
| Grant date | Jun 11, 1996 |
| Priority date | — |
| Expiry date | Sep 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Two-layer or multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method. A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11)consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (1 1), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29). The adhesive layer (11) consists of an adhesive material which in a certain temperature range has a higher hardness than the region (2a) of the support plate (2) adjoining the first conductor pattern (3 ), and the first conductor pattern (3) is …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.