Patent · US Expired

Internal soldering in metal/ceramic composites

US5525432A · kind A · utility

8Cited by

9References

18Claims

0Family size

Assignee

Hoechst Ceramtec AG · DE

Inventors

Tha Do-Thoi · Westerburg, DE
Gerd Meier · Oettingen, DE
Klaus Popp · Nürnberg, DE
Peter Stingl · Achern, DE

Key dates

Filing date	Jun 10, 1994
Grant date	Jun 11, 1996
Priority date	—
Expiry date	Jun 10, 2014

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1291
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The invention relates to a composite body in which a ceramic component and a metal component are bonded to one another by internal soldering. The internal soldering is effected with soldering composition in a recess (2) within a component (1) of the one material in which there is arranged a component (3) of the other material which is shaped to fit accurately. The recess (2) is, at at least one end-face opening, surrounded by a chamfer (5) having an angle .phi. smaller than 35.degree. C., while the wetting angle .beta. between the soldering composition and the plane of the component surface in which the recess is located is smaller than 40.degree..

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.