Epoxy resin compositions
US5525685A · kind A · utility
2Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1991 |
| Grant date | Jun 11, 1996 |
| Priority date | — |
| Expiry date | May 29, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Free-flowing powdery compositions comprising: (A) liquid or semi-solid epoxy resins; and (B) solid colloidal condensation polymers of urea or melamine and formaldehyde having a pore volume greater than 1 cm .sup.3 /g and a specific surface area greater than 5 m.sup.2 /g. The novel compositions can be typically used as powder coating compositions, adhesives, casting resins and molding compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.