Copper-based paste containing refractory metal additions for densification control
US5525761A · kind A · utility
5Cited by
14References
6Claims
0Family size
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Key dates
| Filing date | Jun 6, 1995 |
| Grant date | Jun 11, 1996 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.