Multilayer metal leadframe
US5525836A · kind A · utility
3Cited by
7References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1995 |
| Grant date | Jun 11, 1996 |
| Priority date | — |
| Expiry date | Feb 21, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe for use in mounting and interconnecting an integrated circuit. A first or base metal layer of the leadframe comprises at least one of brass or other copper alloy. A second, conducting layer atop the base layer comprises at least one of aluminum or an aluminum alloy. A third, upper layer on the second layer comprises at least one of copper or a copper alloy. The first, second and third layers are formed into a multilayer clad strip, a portion of at least the third layer being selectively removed to expose a selected pattern of the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.