Fabrication method for digital micro-mirror devices using low temperature CVD
US5526951A · kind A · utility
66Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Sep 30, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved support post (16, 23) for micro-mechanical devices (10). A conductive layer (33, 71) is deposited on a substrate at all places where the support posts (16, 23) are to be located. A spacer layer (41, 81) is then deposited and etched to form vias (41a, 81a). Each via (41a, 81a) defines the outer surface of a support post (16, 23). The bottom surface of each via is at the conductive layer (33, 71). This permits an aluminum CVD process to selectively fill the vias (41a, 81a), thereby forming the support posts (16, 23).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.