Chemical mechanical polishing slurry for metal layers
US5527423A · kind A · utility
538Cited by
63References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Oct 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry for use in chemical-mechanical polishing of a metal layer comprising high purity fine metal oxide particles uniformly dispersed in a stable aqueous medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.