Preconditioner for a polishing pad and method for using the same
US5527424A · kind A · utility
87Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 30, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Jan 30, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A preconditioning plate (10) prepares the surface of a polishing pad (24) to prepare the pad's surface for subsequent metal polishing of semiconductor wafers (27). The preconditioning plate has at least three intersecting radial ridges (14) on its surface and is made from a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to actual polishing to provide a uniform and stable polishing surface. The preconditioning plate does not abrade or wear away the polishing pad, nor does it form grooves in the polishing pad. Additionally, the preconditioning plate is reusable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.