Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
US5527445A · kind A · utility
41Cited by
23References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Jan 9, 2015 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F11/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for repairing degraded sections of metal tubes, such as heat exchanger tubes, by in situ electroforming utilizes a probe containing an electrode. The probe is movable through the tube to the site of degradation and is sealed in place, thereby creating an electrochemical cell. Electrolyte flows from a reservoir through the cell and a structural layer of metal is deposited on the tube using a pulsed direct current and a duty cycle of 10-60%. The metal layer so formed possesses an ultrafine grain size preferably with a highly twinned microcrystalline structure giving the layer excellent mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.