Molded structure
US5527585A · kind A · utility
45Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Dec 12, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A novel molded structure especially useful as a rigid, load-bearing structure, is provided. Also provided is a novel process for molding the structure, which may be in the form of a pallet. By the process, the structure is chilled as it is being formed. Recycled resins including contaminants of limited compatibility may be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.