Apparatus and method for depositing metal particles on a dielectric substrate
US5527586A · kind A · utility
8Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Dec 19, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for making a template used in manufacturing printed circuit boards is disclosed. The template is made from boron nitride, silicon nitride or similar material which has a melting temperature higher than the melting temperature of the metal forming the conductors in the printed circuit board, is readily machinable or moldable with the desired circuit pattern, and does not adhere to the metal conductors after the metal particles have been melted onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.