Pressure-sensitive adhesive systems with filler
US5527595A · kind A · utility
6Cited by
38References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Aug 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided an adhesive system comprised of a pressure-sensitive adhesive matrix having dispersed therein organic particulate solids having a particle size no greater than 300 microns, and generally no greater than 225 microns, which matrix may have at least one, and generally two, sides coated with an unfilled pressure-sensitive adhesive material, which adhesive materials generally may be acrylic materials. Such adhesive system is one generally provided as a sheet, including elongated tapes, having a thickness of from about 25 to 60 mils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.