Oriented multilayer heat sealable packaging film capable of withstanding high altitude effects
US5527608A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Dec 27, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A biaxially oriented heat sealable multilayer film structure, suited for use in high altitude applications, which comprises: (a) a core substrate having two surfaces, comprising i) a layer of homopolymer polyolefin and ii) a layer of block copolymer of ethylene and propylene having a MFR of 1 to 10, adjacent to at least one side of i); (b) a polymeric heat sealable layer on one surface of said core substrate, said heat sealable layer comprising a polymeric material selected from the group consisting of a terpolymer of ethylene, propylene and butene-1, a random copolymer of ethylene and propylene, a random copolymer of propylene and butene-1, and blends thereof; and optionally, (c) a high density polyethylene (HDPE) layer adjacent to the other surface of said core substrate (a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.