Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit
US5527627A · kind A · utility
30Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Nov 21, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.