Pb-free Sn-Ag-Cu ternary eutectic solder
US5527628A · kind A · utility
56Cited by
10References
20Claims
0Family size
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Key dates
| Filing date | Feb 24, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Feb 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.