Hot melt adhesive composition
US5527845A · kind A · utility
6Cited by
4References
7Claims
0Family size
Inventors
Key dates
| Filing date | Jul 15, 1993 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Jul 15, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 10% to about 80%, by weight, of an alkali soluble polymer; about 0 to about 30%, by weight, of a poly (vinyl methyl ether); about 30% to about 70%, by weight, of a tackifying resin; and about 5% to about 30%, by weight, of a suitable plasticizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.