Automatic surface profiling for submicron device
US5528033A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1995 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Mar 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for automatically providing a surface profile analysis of a submicron device using a microscope system typically used to measure critical dimensions of the submicron device is disclosed. The method generates a data point array that is linearly interpolated along a particular scan line measured. The system then calculates an angle for performing a rotational correlation then rotates the measurement profile from the scan line to an absolute horizontal position based on this rotational correlation angle. Next, the system separates the scan line into independent subset features having line and trench features. The number of these line and trench features are then determined in the scan line and using the data point array, the system then calculates the height, width, and angle for each subset feature in that scan line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.