Hermetic surface mount package for a two terminal semiconductor device
US5528079A · kind A · utility
21Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1991 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Dec 23, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package houses a single two terminal semiconductor component. The package is hermetically sealed and is adapted for surface mounting. The package consists of an open ceramic box that has slots for external leads. A glass seal provides the means for sealing the leads to the ceramic box. The semiconductor element is in a die form and one terminal is directly bonded to one of the external leads. The other terminal is bonded to a clip that in turn is bonded to the other lead. A lid is sealed to the top of the ceramic box to provide the hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.