Integrated circuit device and its manufacturing method
US5528458A · kind A · utility
15Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1994 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Nov 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device is disclosed that comprises a bare integrated circuit chip, having an integrated circuit section and pad sections, said chip being mounted on an insulated surface of a substrate, and an electro-conductive circuit pattern wiring formed on said insulating surface along the periphery of said chip. Tape automated bonding wiring is used to electrically connect the pad sections of the chip to an end of the circuit pattern wiring. Terminals are electrically connected to the other end of the circuit pattern wiring for use in electrically connecting the integrated circuit device to electronic equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.