Printed circuit assembly having component locating features
US5528461A · kind A · utility
10Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1993 |
| Grant date | Jun 18, 1996 |
| Priority date | — |
| Expiry date | Nov 8, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit assembly (5) has a surface mount electronic component (14), circuit board (10), and locating features to align (16) the surface mount electronic component on the printed circuit board. The locating features may comprise solder bumps (24) on the printed circuit board. The locating features are arranged on the surface of the printed circuit board to lie proximal to the main body (22) of the surface mount electronic component. The locating features prevent movement of the surface mount electronic component prior to soldering the surface mount electronic component to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.