Apparatus and method for ion beam polishing and for in-situ ellipsometric deposition of ion beam films
US5529671A · kind A · utility
58Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1994 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Jul 27, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention uses an ion beam to polish a rotatable substrate from an oblique angle between the horizontal and the center line of the gun to the substrate to upgrade the quality of substrates. Alternatively, the substrates are left in the high vacuum chamber without breaking the vacuum for in-situ deposition of thin films thereby avoiding contamination, and to provide premium optics. A wobble stick arrangement is provided to align the ellipsometer reflected beam with the ellipsometer detector during operation without breaking the vacuum which, if broken, would admit contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.