Method for fabricating LCD substrates having solderable die attach pads
US5529863A · kind A · utility
8Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 1995 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Jul 17, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1345
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating solderable pads (106) onto a glass substrate (101) includes the step of depositing a seed metallization layer (step 406) after the polyimide layer is cured (step 404) but prior to buffing the alignment layer (step 414). The seed metallization layer can done by, for example, sputter depositing indium-tin, tin or copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.