Process for fabricating thin film transistor
US5529937A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1994 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Jul 20, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After a pattern is transferred on silicon film crystallized by annealing, the silicon film is annealed by radiation of intense rays for a short time. Especially, in the crystallizing process by annealing, an element which promotes crystallization such as nickel is doped therein. The area not crystallized by annealing is also crystallized by radiation of intense rays and a condensed silicon film is formed. After a metal element which promotes crystallization is doped, annealing by light for a short time is performed by radiating intense rays onto the silicon film crystallized by annealing in an atmosphere containing halide. After the surface of the silicon film is oxidized by heating or by radiating intense rays in a halogenated atmosphere and an oxide film is formed on the silicon film, the oxide film is then etched. As a result, nickel in the silicon film is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.