Elastomeric ethylene copolymers for hot melt adhesives
US5530054A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1995 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Mar 24, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed are hot melt adhesives comprising ethylene/alpha-olefin copolymers prepared with either supported or unsupported metallocene-alumoxane catalysts for applications in hot melt adhesives used in automotive product assembly, packaging and food packaging. These ethylene copolymers have weight average molecular weight ranging from about 20,000 to about 100,000 and comonomer weight percent ranging from about 6 to about 30. The hot melt adhesive composition includes the ethylene copolymer and a compatible tackifier at a ratio of tackifier to copolymer of from 70:30 to 30:70 and may also include up to 30 weight percent of a paraffinic and microcrystalline wax of the copolymer and tackifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.