Silicone composition capable of yeilding a cured product having good thermal conductivity
US5530060A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1995 |
| Grant date | Jun 25, 1996 |
| Priority date | — |
| Expiry date | Mar 21, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone composition is of the addition reaction type which comprises a vinyl group-containing organopolysiloxane, an organohydrogenpolysiloxane which has at least one hydrogen atom joined to a silicon atom in one molecule, a platinum group metal catalyst, and an aluminum oxide powder which is substantially round or spherical in shape with an average particle size of not larger than 50 .mu.m and wherein when the aluminum oxide powder is subjected to extraction of alkali metal ions and halogen ions under conditions of 121.degree. C., 2 atmospheric pressures, 100% R.H. and 20 hours, the contents of both ions are, respectively, not larger than 5 ppm. The cured product obtained from the composition has high thermal conductivity and the composition is useful as a sealant of electric and electronic parts and can prevent the parts from being corroded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.